Single crystal silicon adopts diamond wire into trend, polysilicon manufacturing cost declines, bottleneck

Abstract At present, the use of diamond wire slices in single crystal silicon chips has gradually become a trend. The diamond wire is characterized by thinner and more efficient silicon cutting. The cutting speed of the diamond wire is twice that of the ordinary rigid wire, and no special cutting fluid is needed. Water can be used as the cooling liquid. And the diameter of the diamond wire...
At present, the use of diamond wire slices for single crystal silicon chips has gradually become a trend. The diamond wire is characterized by thinner and more efficient silicon cutting. The cutting speed of the diamond wire is twice that of the ordinary rigid wire, and no special cutting fluid is needed. Water can be used as the cooling liquid. Moreover, the diamond wire has a small diameter and a low wire loss, which facilitates the cutting of thinner silicon wafers. It is reported that the current mainstream cutting thickness is 190±10 microns. With the improvement of battery technology, thinner silicon wafers will become the mainstream trend.

Due to its lattice ordering characteristics, single crystal silicon rods can realize the scale application of diamond wires and promote the thinning of silicon wafers, and the silicon material consumption per wafer of silicon wafers will be lower. It is reported that the current single-watt silicon consumption is about 4.3 grams, and the future silicon consumption will be lower. BOC International expects that, with the improvement of non-silicon cost, the cost of monocrystalline silicon wafers will fall faster than that of polysilicon wafers, and the price difference between the two will be further shortened.

In addition, the fixed investment from the diamond line equipment is showing a downward trend year by year. According to the information of the Bank of China International, the current cost is only about 1/5 of the peak period.

The space for the cost of manufacturing polysilicon is extremely limited.

It is reported that the cost reduction of polycrystalline silicon wafers is mainly to improve efficiency and ingot size, but the size of silicon ingots is not as large as possible, which requires comprehensive consideration of expanded technical barriers and expanded economic effects.

In addition, many brokers analyzed that single crystal silicon has a broader space for conversion efficiency, and conversion efficiency will have an important impact on cost. According to estimates, every one percentage point increase in conversion efficiency will reduce the system cost of solar power plants by about 7%. .

It is reported that the laboratory world record for monocrystalline silicon cell efficiency is 24.7%, and the world record for polysilicon battery laboratory efficiency is 20.4%. At present, the photoelectric conversion efficiency of large-scale industrialized monocrystalline silicon cells is 19%-20%, high-efficiency single crystal (HIT) can reach 23%-24%, and the photoelectric conversion efficiency of polycrystalline silicon cells is 17%-18. %. The efficiency of single crystal cell improvement is greater than that of polycrystalline cells.

According to research and analysis, "At present, polycrystalline conversion efficiency is up to 18%, and all the available technologies for polysilicon are now used, and no suitable method has been found to further improve conversion efficiency."

BOC International’s conclusion is the same as that of Changjiang Securities. “Polycrystals are close to the efficiency limit, but there is still much room for development in single crystals.”

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